Epoxy Resin 638

CAS# 28064-14-4

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Property

  • Epoxy Equivalent Weight
  • Color
  • Viscosity @52 °C, Brookfield Viscosity
  • Specific Gravity @ 25°C
  • Hydrolyzable Chloride

Unit

  • g/eq
  • Gardner
  • Cps
  • g/ml
  • ppm

Specification

  • 172-185
  • 3 Maximum
  • 20000-40000
  • 1.22
  • 1000 Maximum

Application

Epoxy Resin 638 functions as both a substrate and a resin. It is commonly used in the industrial and adhesive industries. Applications include: Resin for electronic potting, encapsulation, casting, high-pressure laminating, filament winding, coatings, adhesives, and food-contact coatings; composite aircraft body components; industrial fabric finishes; surface treatment, binder, or adhesion promoter on fiberglass, polyester, nylon, and inorganic mineral filler substrates; baking applications; production of vinyl ester resins; epoxy resin adhesion modifier; viscous modifier for epoxy novolacs and bisphenol A resins.

Molecular Formula

C56H64O3S

Market Segment

Adhesives