Epoxy Resin 638
CAS# 28064-14-4
Property
- Epoxy Equivalent Weight
- Color
- Viscosity @52 °C, Brookfield Viscosity
- Specific Gravity @ 25°C
- Hydrolyzable Chloride
Unit
- g/eq
- Gardner
- Cps
- g/ml
- ppm
Specification
- 172-185
- 3 Maximum
- 20000-40000
- 1.22
- 1000 Maximum
Application
Epoxy Resin 638 is a versatile resin that functions as both a substrate and a binder, making it highly suitable for a wide range of industrial and adhesive applications. It is commonly used in resin systems for electronic potting, encapsulation, casting, high-pressure laminating, filament winding, coatings, and adhesives—including those approved for food contact. The resin exhibits excellent thermal stability, high heat resistance, and strong chemical resistance, making it ideal for structural and electrical laminates, surface treatments, and composite aircraft body components. Epoxy Resin 638 is also used as a binder in grinding and polishing abrasives and can act as a resin modifier or adhesion promoter on substrates such as fiberglass, polyester, nylon, and mineral fillers. Additionally, it is utilized in the production of vinyl ester resins, as a viscosity modifier for epoxy novolacs and Bisphenol A resins, and in the manufacture of printed circuit board laminates with improved solder bath resistance when blended with brominated resins.
Packaging
ChemCeed offers this material in 55 gallon drums. Please inquire about other packaging options.
Synonyms
Phenol, polymer with formaldehyde, glycidyl ether
Molecular Formula
C56H64O3S
Market Segment
Adhesives, Paints, Inks & Coatings
Product Uses
Adhesives & Cements, Coil Coatings, Composites, Marine Coatings, Paint & Coatings, Photocure Industrial Coatings, Potting & Encapsulation